JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls.
AI’s hunger for memory has finally spilled out of the data center and into the living room, turning what used to be a cheap PC upgrade into one of the most painful line items on a build sheet. The ...
The debut of DeepSeek R1 sent ripples through the AI community, not just for its capabilities, but also for the sheer scale of its development. The 671-billion-parameter, open-source language model’s ...
Major technology firms are betting big on AI, creating huge demand for hardware, software, and services that underpin this massive, burgeoning market. That includes Qualcomm, which is rolling out new ...
KIOXIA America, Inc. today announced that it has begun sampling 1 new Universal Flash Storage 2 (UFS) Ver. 4.1 embedded memory devices with 4-bit-per-cell, quadruple-level cell (QLC) technology.
Congatec’s lineup includes five embedded board variants that support several memory standards, such as LPDDR5X, DDR5 SO-DIMM, ...
TOKYO--(BUSINESS WIRE)--Kioxia Corporation, a world leader in memory solutions, today announced that it has begun sampling new Universal Flash Storage 1 (UFS) Ver. 4.1 embedded memory devices with ...
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