At-speed testing and delay defect analysis have become increasingly critical in ensuring the reliability and performance of modern integrated circuits. As circuit complexity grows alongside rapid ...
The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...
Today's systematic and more subtle random defects are not only decreasing yields, but are also increasing the number of test escapes, or defective parts per million (DPPM) shipped out. One of the ...
Final electrical test remains one of the best ways to assess a circuit’s ultimate viability. But we know that, unfortunately, even 100% end-of-line electrical testing of semiconductor wafers will not ...
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Please provide your email address to receive an email when new articles are posted on . Researchers found that VRVF results were in reasonable agreement with baseline SAP. VRVF exams had higher ...
Synopsys chose the International Test Conference to highlight two significant initiatives: defect-detection enhancements in TetraMAX ATPG through slack-based cell-aware test capability, and a new STAR ...
Charlotte, N.C. — The IC design community has begun to question its goal of achieving fewer than 100 defective parts per million. Citing the difficulty and costs associated with the stringent ...
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