A layer of graphene can reduce the working temperature in hotspots inside a processor by up to 25 percent – which can significantly extend the working life of computers and other electronics. An ...

UNIVERSITY PARK, Pa. — Next-generation electronics will feature smaller and more powerful components that require new solutions for cooling. A new thermoelectric cooler developed by Penn State ...

What started as a fun experiment to create a decorative diamond “owl” for distinguished ...

A recent review focuses on the development and optimization of thermal management technologies (TMTs) for spacecraft electronics. These technologies address the challenges of heat acquisition, ...

Power density plays a critical role in making power electronic systems smaller, more efficient, and more cost-effective. As power density increases, so does the heat generated inside a device.

The high power consumption of electronic systems, driven by applications in Artificial Intelligence (AI) and High-Performance Computing (HPC), is generating a significant demand to address overheating ...

Thermal management has long been a key challenge facing design engineers. For decades, engineers have faced trying to dissipate heat from densely packed electronics that have continued to shrink in ...

Ventiva's thermal management approach looks to address the growing heat challenges emerging in AI‑driven edge systems.

SHANGHAI, CN / ACCESS Newswire / November 24, 2025 / Dow (NYSE:DOW) has announced the official opening of its first Cooling Science Studio, located at the Shanghai Dow Center. As Dow's first ...