If the HPC and AI markets need anything right now, it is not more compute but rather more memory capacity at a very high bandwidth. We have plenty of compute in current GPU and FPGA accelerators, but ...

Micron has now entered the HBM3 race by introducing a “second-generation” HBM3 DRAM memory stack, fabricated with the company’s 1β semiconductor memory process technology, which the company announced ...

The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory stack. A JEDEC move made that unnecessary with this generation, but it’s ...