The main objective of this project is to let students apply the image processing techniques that been taught in class in a given conditions based on their title. This particular project involved the ...

This new technical paper titled “End-to-end deep learning framework for printed circuit board manufacturing defect classification” is from researchers at École de technologie supérieure (ÉTS) in ...

Board manufacturers are boosting their investment in inspection, test and analytics to meet the increasingly stringent demands for reliability in safety-critical sectors like automotive. This ...

The printed circuit board assembly process has undergone revolutionary changes over the past three decades. What once relied ...

There are a number of complex tasks involved in the manufacturing of electronic assemblies, all of which can go wrong. In order to ensure quality standards are met, the fabrication of the printed ...

It has taken almost a decade for automated optical inspection (AOI) systems to establish their place on PCB production lines. In the same period, the number of AOI vendors and the variety of AOI ...

Geopolitical tensions and pandemic-related disruptions have revealed deep vulnerabilities within the supply chain for manufacturers as well as the businesses and governments that rely on them. In ...

Tombstoning is a defect where a two-leaded, wrap-around lead-style termination chip component fails to lay down appropriately and allow solder to simultaneously make a required electrical/mechanical ...