The federal award enables the High Density Electronics Center to upgrade its equipment and capabilities while conferring status as a Power Packaging Center of Excellence.

GaN-, and silicon-based power transistors, modules, and other basic building blocks for more robust, efficient, and ...

The increasing AI and high-performance computing workloads demand power solutions that combine efficiency, reliability and ...

The MCPF1525 is packaged in an innovative vertical construction that maximizes board space efficiency and can offer up to a ...

Enabling higher power within the same rack space, Microchip’s MCPF1525 power module delivers up to 25 A per device, stackable ...

SHENZHEN, GUANGDONG, CHINA, January 21, 2026 /EINPresswire.com/ -- As global electronics manufacturing continues to ...

Power modules are high-power switching circuits that convert DC- in AC-currents in electric vehicles, renewable energy, and many more applications. New materials [14] and device technologies [14], ...

Dublin, Jan. 28, 2026 (GLOBE NEWSWIRE) -- The "Power Discrete and Module Market Report 2026" has been added to ResearchAndMarkets.com's offering. The report offers insights into market size, regional ...

The new power amplifier module (PAM) from NEC Corporation is a compact, high-efficiency PAM for the sub-6GHz band designed ...

Developing a power module requires enhanced design and verification methods. Currently, multiple iterations are needed to get the design done. Today, design and manufacturing processes are heavily ...

Power devices continue to evolve rapidly as SiC and GaN technologies become more highly integrated, easy to use, and cost-effective. Meanwhile, steady improvements in MOSFET structures and processes ...