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Abstract: A new concept for encapsulation of discrete bipolar high-power devices using epoxy mold compound (EMC) is demonstrated on silicon 4.5-kV press-pack fast recovery diodes (FRDs) with wafer ...
High-Temperature Encapsulation Materials for Power Modules: Technology and Future Development Trends
Abstract: The applications of wide bandgap (WBG) semiconductors represented by silicon carbide (SiC) and gallium nitride (GaN) in power modules are currently limited by the thermal stability of ...
The p2 Update sites listed above (since 0.13.0) contain a japicmp report against the last released version to make it easier to identify API changes. The Eclipse LSP4J project uses Semantic Versioning ...
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