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7:09
YouTube
Semicon Talk
[Eng Sub] Wafer Level Chip Scale Package (WLCSP)
1. WLCSP : Die, Repassivation, Bump : Repassivation(PI, PBO - HD MicroSystems) : Batch Process 2. Structure : Bump on Bond Pad : Bump on RDL : Backside Coating - Backside Lamination Tape : Side protection - 6, 5, 4-side 3. Process : Bump on RDL 4. Application : Power management IC , Audio codec
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Bigger panels. Smarter packaging. Panel-level packaging takes chipmaking to the next level by fitting more chips onto large-format substrates, helping cut costs and boost output. Explore how our Kallisto product family brings this technology to life. https://bit.ly/4mCRx3S | Lam Research Corporation
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